Electronic engineering
By: Wang, Dongxing [Editor]
Material type:
TextLanguage: English Language Publisher: London CRC Press 2018Edition: 1st edDescription: 266 pISBN: 9780429890963 ; 9780429469503 Subject(s): TECHNOLOGY & ENGINEERING / Electrical | TECHNOLOGY & ENGINEERING / Electronics / General | Electrical engineering | Electronics | Information technology | Nanoscience | Nanotechnology | TECHNOLOGY & ENGINEERING / MechanicalAdditional physical formats: Print version: No titleDDC classification: 621.3 Online resources: Click here to access online Abstract: The 4th International Conference of Electronic Engineering and Information Science 2017 (ICEEIS2017) was held January 7-8, 2017 in Haikou, P.R. China. This conference was sponsored by the Harbin University of Science and Technology, China. The conference continued the tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities. The proceedings contains contributions in the fields of Electronic Engineering, Information Science and Information Technologies, Computational Mathematics and Data Mining, Mechatronics, Control and Automation andMaterial Science and Technologies of Processing.
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Main Library Online | Main Library Online | ebooks collection | 621.3 E42 (Browse shelf) | Available | 30916 |
The 4th International Conference of Electronic Engineering and Information Science 2017 (ICEEIS2017) was held January 7-8, 2017 in Haikou, P.R. China. This conference was sponsored by the Harbin University of Science and Technology, China. The conference continued the tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities. The proceedings contains contributions in the fields of Electronic Engineering, Information Science and Information Technologies, Computational Mathematics and Data Mining, Mechatronics, Control and Automation andMaterial Science and Technologies of Processing.
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